SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

摘要

Provided is a semiconductor device which includes a flexible circuit board whereupon a first external electrode is arranged on a first surface and second and third external electrodes are arranged on a second surface; a plurality of memory devices and passive components; a supporting body having a groove on one surface; and an arithmetic processor device. The memory devices and the passive components are connected to the first external electrode, the one surface of the supporting body is bonded on the first surface of the flexible circuit board so that a groove stores the memory devices and the passive components. The flexible circuit board is bent along the periphery of the supporting body, and wraps the side surfaces and the other surface of the supporting body. On the flexible circuit board, the second external electrode is arranged on the second surface which faces the first external electrode, and the third external electrode is arranged on the second surface which is bent to the other surface of the supporting body. The arithmetic processor device is connected to the second external electrode, and a bump is formed on the third external electrode.