| 摘要 |
Semiconductor chips are fixed to one of two opposite surfaces of a leadframe, and the leadframe is electrically connected to each semiconductor chip with wires. After having applied water-soluble masking ink to the other surface of the leadframe, a sealed structure is molded. Then, when the sealed structure is cut with cutting water into individual semiconductor packages, burrs of the mold resin formed on the other surface side of the leadframe are removed by the cutting water while the masking ink on the other surface of the leadframe is dissolved and removed by the cutting water. |
