发明名称 |
THERMALLY ENHANCED ELECTRICALLY INSULATIVE ADHESIVE PASTE |
摘要 |
A thermal interface material comprises larger conformable thermally conductive particles, and smaller ceramic thermally conductive particles in a binder. The binder can include thermoplastic (and optionally thermoset) particles and a fugitive liquid which are substantially insoluble in each other. The binder can also include a liquid epoxy. Each of the larger thermally conductive particles is itself a cohesive yet conformable agglomeration of platy particles.
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申请公布号 |
CA2719639(A1) |
申请公布日期 |
2009.10.01 |
申请号 |
CA20092719639 |
申请日期 |
2009.03.26 |
申请人 |
DIEMAT, INC. |
发明人 |
CZUBAROW, PAWEL;DIETZ, RAYMOND L.;PATELKA, MACIEJ |
分类号 |
C09J9/00;C09J11/04 |
主分类号 |
C09J9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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