发明名称 POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND
摘要 <P>PROBLEM TO BE SOLVED: To provide a new polymeric compound that can be used as a base component of a positive resist composition, and to provide a positive resist composition containing the polymeric compound, and a method of forming a resist pattern using the positive resist composition. <P>SOLUTION: The positive resist composition contains a base component (A) which exhibits increased solubility in an alkali developing solution under action of an acid, and an acid generator component (B) which generates an acid upon exposure, wherein the base component (A) includes a polymeric compound (A1) containing a structural unit (a0) represented by general formula of -CH<SB>2</SB>C(R<SP>1</SP>)-[-C(=O)-O-A-C(=O)-O-B-C(=O)-O-R<SP>2</SP>]. In formula, R<SP>1</SP>represents a hydrogen atom, a lower alkyl group or a halogenated lower alkyl group; A represents a bivalent linking group; B represents a bivalent linking group; and R<SP>2</SP>represents an acid dissociable, dissolution inhibiting group. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009223300(A) 申请公布日期 2009.10.01
申请号 JP20090027467 申请日期 2009.02.09
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SHIMIZU HIROAKI;NAKAMURA TAKESHI;DAZAI NAOHIRO;SHIONO HIROHISA;HIRANO TOMOYUKI
分类号 G03F7/039;C08F20/28;G03F7/004;H01L21/027 主分类号 G03F7/039
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