| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device improving connection reliability of a connection part for electrically connecting between corresponding electrode pads of a semiconductor package and a wiring board. <P>SOLUTION: The semiconductor device includes a package substrate 21 on which a semiconductor chip 22 is mounted, and the wiring board 10 electrically connected to the package substrate 21 via connection parts 27a. Each connection part 27a includes a conductor wire, which has a portion wound obliquely to an axis vertical to a face which is a main surface of the package substrate 21 and is connected to the wiring board 10. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
