发明名称 WIRING BOARD AND MANUFACTURING PROCESS THEREFOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board which has an insulating basic substance formed of glass ceramic, is high in bonding strength for bonding a metal member, and also high in reliability. <P>SOLUTION: The wiring board includes the insulating basic substance 1 formed of glass ceramic and a wiring conductor 2 formed on the basic substance 1. A bonding conductor 3 formed on the surface of the insulating basic substance 1 is composed of a first alloy layer 3a mainly formed of Ag and Cu containing an active metal that is at least one of Ti, Zr, and Hf, and a second alloy layer 3b mainly formed of Ag, Cu, and Ni and formed on the surface of the first alloy layer. The second alloy layer 3b is coated with an Ni plating layer 4 and an Au plating layer 5 overlaid in an increasing order. A metal member 7 is bonded to the Au plating layer via solder 6. The bonding conductor 3 has high bonding strength and the Ni plating layer has high adhesion strength. By this, the metal member 7 bonded to the Ni plating layer via the solder exhibits high bonding strength to offer high reliability. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009224651(A) 申请公布日期 2009.10.01
申请号 JP20080069013 申请日期 2008.03.18
申请人 KYOCERA CORP 发明人 WAKASAKI AKIRA
分类号 H01L23/13;H01L23/12;H05K3/24 主分类号 H01L23/13
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