| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer resin wiring board which is excellent in connection reliability by surely evading crack generation in a stacked via structure positioned right below a die area. SOLUTION: The multilayer resin wiring board 11 has the stacked via structures 82 and 83 inside a buildup layer 15. Inner layer side filled via conductors 23, 33 and 43 in the stacked via structures 82 and 83 positioned right below an electronic component loading region 5 are shifted in the center direction of the electronic component loading region 5. The shift amount S2 of the stacked via structure 83 positioned right below the outer peripheral part 5b of the electronic component loading region 5 is larger than the shift amount S1 of the stacked via structure 82 positioned right below the center part 5a of the electronic component loading region 5. COPYRIGHT: (C)2010,JPO&INPIT |
