| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance an adhesive strength between a card base and an IC module. <P>SOLUTION: This IC card includes: the card base 2 having a housing recess 11; a counterbore part 14 formed along a circumference on an inner bottom of the housing recess 11 of the card base 2; the IC module 3 housed in the housing recess 11 of the card base 2 and adhered with an adhesive 15; and a protrusion 10 formed along the circumference of the IC module 3, fitted into the counterbore part 14 of the housing recess 11 and adhered with the adhesive 15. <P>COPYRIGHT: (C)2010,JPO&INPIT |
