发明名称 Lead frame module for manufacturing light emitting diodes
摘要 A lead frame module integrally formed from a single thin metal sheet includes: parallel first and second rails extending in a first direction; and first and second lead frame sets connected to the first and second rails, respectively. The first and second lead frame sets respectively include a plurality of lead frames extending in a second direction perpendicular to the first direction. Each of the lead frames of the first and second lead frame sets has a pair of connecting leads and a pair of packaging leads. Each of the packaging leads is connected to a respective one of the connecting leads. The connecting leads of the lead frames of the first lead frame set are interdigitated with and are connected to the connecting leads of the lead frames of the second lead frame set.
申请公布号 US2009244875(A1) 申请公布日期 2009.10.01
申请号 US20080230194 申请日期 2008.08.26
申请人 发明人 SU CHENG-HONG
分类号 H05K7/18;H01L33/62 主分类号 H05K7/18
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