发明名称 SIDE VIEW LED PACKAGE AND BACK LIGHT MODULE COMPRISING THE SAME
摘要 Disclosed is a side view LED package that can be more accurately mounted onto a surface of a substrate such as a printed circuit board without distortion includes a first portion of a body allowing light to be emitted in front thereof, the first portion having a horizontal plane formed on a top or bottom side thereof; and a second portion of the body positioned backward with respect to a back end boundary line of the first portion, the second portion being formed with an inclined plane that is adjacent to the horizontal plane and has height decreased from the back end boundary line, wherein the inclined plane is partially formed with an added thickness portion that is flush with the horizontal plane.
申请公布号 US2009242920(A1) 申请公布日期 2009.10.01
申请号 US20090411860 申请日期 2009.03.26
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 CHOI JONG BUM;LEE MYUNG HEE;KIM WON IL;SO JI SEOP
分类号 H01L33/48 主分类号 H01L33/48
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