发明名称 |
REFLOW SOLDER OVEN WITH COOLING DIFFUSER |
摘要 |
<p>A diffuser plate for a reflow oven includes an upper surface and a plurality of nozzle openings therein. Each of the plurality of nozzle openings has a raised surrounding portion for restricting condensed flux on the upper surface of the diffuser plate from flowing through the nozzles. A drain hole permits condensed flux on the upper surface to flow downward through the plate.</p> |
申请公布号 |
WO2009120414(A1) |
申请公布日期 |
2009.10.01 |
申请号 |
WO2009US33611 |
申请日期 |
2009.02.10 |
申请人 |
ILLINOIS TOOL WORKS INC.;DAUTENHAHN, JONATHAN M. |
发明人 |
DAUTENHAHN, JONATHAN M. |
分类号 |
B23K1/012 |
主分类号 |
B23K1/012 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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