APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

摘要

PURPOSE: An apparatus and a method for processing a substrate are provided to deposit the layer with the uniform thickness on the top of the substrate. CONSTITUTION: An apparatus for processing a substrate includes a processing chamber(10), a supporting member(30), and a shower head(20). The processing chamber provides the internal space in which the process about a substrate gets accomplished. The supporting member is installed inside the processing chamber. The supporting member supports the substrate(W). The shower head is positioned on the top of the supporting member. The shower head supplies the source gas towards the supporting member. The shower head includes the first jetting surface(24) and the second jetting surface(26). The exit of the first spray holes for spraying the source gas is formed in the first jetting surfaces. The exit of the second spray holes for spraying the source gas is formed in the second jetting surfaces.