| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which consists of a semiconductor chip connected to a bonding wire and sandwiched between a pair of heat sinks, and can avoid contact of the bonding wire with heat sinks located at a side of the bonding wire even if an opposite interval between both heat sinks is made narrow without using a block for securing the interval. <P>SOLUTION: The loop-like bonding wire 8 projects in a direction where the bonding wire is detached from one face of the semiconductor chip 1. An opposed faces 3a, opposing one face of the semiconductor chip 1 on a first heat sink 3, is located closer to one face of the semiconductor chip 1 than a top part 8a of the bonding wire 8. An opening part 3d is an opening part opposite to the bonding wire 8 of the opposed faces 3a of the first heat sink 3. A part on the top side 8a of the bonding wire 8 is set in the opening part 3d in the state apart from the first heat sink 3. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
