| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To eliminate the use of a separate PSR process by preventing the deflection of a substrate during the manufacturing and after the manufacturing of a substrate and by having a function of a solder resist layer an by preventing the deflection of the substrate caused by a support. <P>SOLUTION: In a manufacturing method, a circuit pattern 56 is formed on both side or single side copper-clad laminate plates at both faces of at a single face, a build-up layer 57 is laminated thereon, and then a solder resist layer 58 is formed on the upper face of the build-up layer 57. By this, a first circuit layer having via holes 54 and including the circuit pattern 56 is formed on one face, and on the other face, an insulation resin layer 50 formed with a second circuit layer including a connection pad for solder ball mounting protruded on the via hole 54, the build-up layer 57 including a large number of insulating layers and a large number of circuit layers formed on the first circuit layer, and the solder resist layer 58 formed on the outermost layer of the build-up layer 57 are included. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
