ELEMENT WAFER AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an element wafer capable of suppressing damage due to propagation of cracking to a film which is laminated on a semiconductor wafer for forming an element thereon. SOLUTION: A recessed portion 10 with an insulating film formed in a recessed shape so as to surround an actual region 6 is provided on the periphery of the actual region 6 where an acceleration sensor 20 is formed on a semiconductor wafer. The recessed portion suppresses propagation of cracking to the portion of the acceleration sensor 20. COPYRIGHT: (C)2010,JPO&INPIT