发明名称 Device for protecting electronic or micro system technical component before mechanical or chemical interference, has nanofilm which is applied on electronic component, where two electrodes are bypassed with interference
摘要 #CMT# #/CMT# The device has a nanofilm (2) which is applied on an electronic component (1). Two electrodes are bypassed with the interference such that the nanofilm is ignited electrically. The electrodes are positioned as two-dimensional electrode layers (4a,4b) in a readily manner. A resistant protective layer (5) is applied mechanically or chemically on the nanofilm, where the protective layer includes silicon carbide, hydrogen or silicon nitride hydrogen. #CMT# : #/CMT# An independent claim is included for a method for electrical igniting of a device. #CMT#USE : #/CMT# Device for protecting an electronic or micro system technical component before mechanical or chemical interference, particularly for the purpose of a reverse engineering. #CMT#ADVANTAGE : #/CMT# The device has a nanofilm which is applied on an electronic component, where two electrodes are bypassed with the interference such that the nanofilm is ignited electrically, and thus ensures that the electronic or micro system technical component is protected in a simple manner. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a schematic view of a reverse engineering protection package. 1 : Electronic component 2 : Nanofilm 3 : Passivation layer 4a,4b : Electrode layers 5 : Protective layer.
申请公布号 DE102008014750(A1) 申请公布日期 2009.10.01
申请号 DE20081014750 申请日期 2008.03.18
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 NAUNDORF, JOERG
分类号 H01L23/29 主分类号 H01L23/29
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