POLISHING PAD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad allowing accurate detection of an optical end point in a state where polishing is being executed, and preventing slurry leakage even when used over a long time.

SOLUTION: This polishing pad 1 is formed by stacking a polishing layer 10 on a cushion layer 13 through an intermediate layer 12. The polishing pad is characterized in that the polishing layer 10 is provided with a polishing region 8 formed with a first opening 11, and a light transmissive region 9 arranged in the first opening 11 and abutting on the intermediate layer 12; the intermediate layer 12 and the cushion layer 13 are provided with a second opening 14 smaller than the light transmissive region 9 and formed to overlap the light transmissive region 9; and the intermediate layer 12 is a composite film with a ceramic deposited on a resin film.

COPYRIGHT: (C)2010,JPO&INPIT