| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent the position deviation of a non-reciprocal circuit element even when solder reflow processing is performed. <P>SOLUTION: A carrier plate 2 includes a recessed part 2c, a solder sheet 3 for fixing a ferrite substrate 1c and the carrier plate 2 is disposed in the inside, and a non-reciprocal circuit element body 1 is fixed by cream solder. When fixing the non-reciprocal circuit element device and a dielectric substrate by reflow, the carrier plate 2 and the ferrite substrate 1c are fixed simultaneously. Thus, high frequency characteristics are not degraded and it is applicable to a lead free product as well. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
