发明名称 HEAT CONDUCTIVE GREASE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a heat conductive grease composition capable of highly filling a heat conductive filler, and having excellent operation efficiency. SOLUTION: The heat conductive grease composition comprises (A) an oil having 10-10,000 mPa s viscosity at 23°C and a group represented by -COOR<SP>1</SP>(wherein, R<SP>1</SP>is a hydrogen atom, or a substituted or an un-substituted monovalent hydrocarbon group) or any functional groups of alkoxy groups, alkenoxy groups or acyloxy groups bound to silicon atom at the molecular chain terminal, and alkylene groups in a larger number than that of the terminal functional groups in the main chain, and (B) the heat conductive filler. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009221311(A) 申请公布日期 2009.10.01
申请号 JP20080065865 申请日期 2008.03.14
申请人 MOMENTIVE PERFORMANCE MATERIALS INC 发明人 KOBAYASHI HIDEKI;TAMURA TAKERU
分类号 C10M169/00;C10M107/50;C10M113/06;C10M113/08;C10M125/04;C10M125/10;C10M155/02;C10N10/04;C10N10/06;C10N20/00;C10N20/02;C10N20/06;C10N30/00;C10N50/10;H01L23/36 主分类号 C10M169/00
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