| 摘要 |
PROBLEM TO BE SOLVED: To provide a package which enables securing an electronic component mounting area, without fail, facilitates operation of filling an under fill into a gap between the area and the bottom face of the electronic component mounted in the area, and meets the demand for miniaturization. SOLUTION: Another package P2 is mounted on the package P1, and the package P1 includes: a plate package body 2, having a front surface 3 and a back surface 4 of rectangular shapes, in a plan view, and is made of a lamination of a plurality of ceramic layers (insulating materials) s1 and s2; the electronic component mounting area 5 situated at the center of the front surface 3 of the package body 2; and a plurality of projections 8 formed on the peripheral side of the surface 3 of package body 2, that is other than the mounting area 5. Each of the projections 8 is composed of a conductor W, and the like. COPYRIGHT: (C)2010,JPO&INPIT
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