| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid ejection head can completely perform protection from an etching liquid. Ž<P>SOLUTION: This method includes the film forming process adapted to form a pressure generating element 300 on a wafer 100 made of a silicon wafer for a fluid channel forming substrate in which the fluid channel forming substrate having a first liquid channel including a pressure generating chamber 12 communicating with a nozzle opening provided thereon is integrally formed, the process adapted to bond a wafer 130 made of a silicon wafer for a bonding substrate in which the bonding substrate having formed thereon a second liquid channel for supplying a liquid to the pressure generating chamber 12 is integrally formed, to the wafer 100 for the fluid channel forming substrate and to bond an organic film 140 to an entire surface of the wafer 130 for the bonding substrate at the opposite side of a bonded side of the wafer 100 for the fluid channel forming substrate, the etching process adapted to form the pressure generating chamber 12 by wet-etching the wafer 100 for the fluid channel forming substrate, the removing process adapted to remove the organic film 140, and the dividing process adapted to divide the wafer 100 and the wafer 130 to be in a predetermined size. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
