发明名称 METHOD OF FORMING WIRING BOARD CONNECTION ASSEMBLY
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of forming a wiring board connection assembly, capable of connecting central conductors of a multi-conductor cable to electrodes of a wiring board, using a connector of high reliability by using an adhesive film. Ž<P>SOLUTION: Each central conductor 22 of a multi-conductor coaxial cable 20 of extra fine conductors is placed on each signaling electrode 12a of a PWB 10, and an adhesive film 32 is placed over all central conductors 22. A press head 36 is lowered to press the adhesive film 32, while heating the adhesive film. The adhesive film 32 melts, while the central conductors 22 are in close contact with the signaling electrodes 12a, and the molten part of the adhesive film 32 wraps around respective central conductors 22 and enters the clearance under the conductor. The adhesive fixes the central conductor 22 to the signaling electrode. This increases the reliability of connection between the central conductor 22 and the signaling electrode 12a, because the central conductor will not completely lift from the signaling electrode 12a and the contact between the central conductor 22, and the signaling electrode 12a is improved. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009224034(A) 申请公布日期 2009.10.01
申请号 JP20080063969 申请日期 2008.03.13
申请人 SUMITOMO ELECTRIC IND LTD 发明人 MISHIMA HIDEHIKO;KOYAMA KEIJI;MARUYAMA KAZUYA
分类号 H01R9/05 主分类号 H01R9/05
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