| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board for reducing the resistivity of a wiring pattern, and a manufacturing apparatus of the wiring board. Ž<P>SOLUTION: The method includes a wiring pattern forming step of ejecting, to a recipient layer formed on a substrate, droplets of a solution containing conductive microparticles dispersed by means of a dispersing agent to form a desired wiring pattern, and a solvent supplying step of further supplying a solvent of the solution at least to the wiring pattern. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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