发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH NON-SYMMETRICAL SUPPORT STRUCTURES |
摘要 |
An integrated circuit package system including: providing a substrate with a wire-bonded die mounted thereover; mounting a first support structure and a second support structure of different size above the substrate; mounting a structure above the first support structure and the second support structure; and encapsulating the wire-bonded die, the first support structure and the second support structure with an encapsulation.
|
申请公布号 |
US2009243068(A1) |
申请公布日期 |
2009.10.01 |
申请号 |
US20080055608 |
申请日期 |
2008.03.26 |
申请人 |
KUAN HEAP HOE;CHOW SENG GUAN;TAY LIONEL CHIEN HUI |
发明人 |
KUAN HEAP HOE;CHOW SENG GUAN;TAY LIONEL CHIEN HUI |
分类号 |
H01L23/12;H01L21/58 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|