发明名称 RESIN INJECTION MOLDING MOLD
摘要 Disclosed is a mold for resin injection molding that can realize rapid heating or cooling. A resin injection molding mold (1) comprises a cavity mold (2) and a core mold (3) and is produced on a base plate (31) by metal photofabrication. The cavity mold (2) is provided with a cavity warm water circuit (23) for allowing warm water for heating to flow and a cavity cold water circuit (24) for allowing cold water for cooling to flow. The core mold (3) is also provided with a core warm water circuit (33) and a core cold water circuit (34). The core mold (3) comprises an air blowing passage (35) for feeding warm air or cold air into a resin molding part (11) and a suction passage (36) for sucking a gas within the resin molding part (11). The resin molding part (11) side of the air blowing passage (35) and the suction passage (36) is formed of a low-density shaping part (32b) that has a low metallic powder sintered density and is permeable to gas. Warm air or cold air can be blown through the low-density shaping part (32b), whereby rapid heating or cooling of the resin injection molding mold (1) can be realized.
申请公布号 WO2009119490(A1) 申请公布日期 2009.10.01
申请号 WO2009JP55636 申请日期 2009.03.23
申请人 PANASONIC ELECTRIC WORKS CO., LTD.;HIGASHI, YOSHIKAZU;ABE, SATOSHI;FUWA, ISAO;TAKENAMI, MASATAKA;YOSHIDA, NORIO 发明人 HIGASHI, YOSHIKAZU;ABE, SATOSHI;FUWA, ISAO;TAKENAMI, MASATAKA;YOSHIDA, NORIO
分类号 B29C33/38;B29C45/26;B29C45/73;C23C24/08 主分类号 B29C33/38
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