A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code.
申请公布号
WO2009088869(A3)
申请公布日期
2009.10.01
申请号
WO2008US88554
申请日期
2008.12.30
申请人
SUN MICROSYSTEMS, INC.;CHOW, ALEX;HOPKINS, R. DAVID;DROST, ROBERT J.