| 摘要 |
PURPOSE: A method and an apparatus for grinding a wafer are provided to grind a wafer with target thickness without influence due to a protecting tape. CONSTITUTION: An apparatus for grinding a wafer includes a grinding unit(3), a transfer unit(4), a noncontact thickness gauge, a contact thickness gauge, and a control unit. The grinding unit grinds a wafer(2). The transfer unit transfers the grinding unit for a grinding operation. The noncontact thickness gauge measures wafer thickness before a grinding process. The contact thickness gauge measures wafer thickness using the grinding process. The control unit controls the grinding thickness with reference to a measure data of the noncontact thickness gauge during the grinding process.
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