发明名称 |
ELECTRO COMPONENT EMBEDDED CIRCUIT SUBSTRATE AND THE FABRICATION METHOD THEREOF |
摘要 |
PURPOSE: An electro component embedded circuit board and a manufacturing method thereof are provided to form an embedded electro component with a fine pattern by stamping the embedded electro component on a board using the mold material with a nano size. CONSTITUTION: A raw material for an embedded electro component is patterned on a board(S10). An insulation layer is covered on the raw material for the embedded electro component(S20). The embedded electro component is formed by selectively compressing the raw material for the embedded electro component covered with the insulation layer.
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申请公布号 |
KR20090103604(A) |
申请公布日期 |
2009.10.01 |
申请号 |
KR20080029318 |
申请日期 |
2008.03.28 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
CHO, JOO HYUN |
分类号 |
H05K1/18;H05K3/30 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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