| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board having solder bumps capable of improving connection reliability with other components. <P>SOLUTION: A wiring board 11 has a wiring board main body 12, a solder resist 30, and solder bumps 41, 42. The solder resist 30 is formed on a top surface 13 of the wiring board main body 12, and includes first openings 31 and second openings 32 having a diameter larger than the first openings 31. The solder bump 41 is disposed in the first opening 31 and the solder bumps 42 is disposed in the second opening 32. In addition, the top portion 43 of the solder bump 41 has a flat face, while the top portion 44 of the solder bump 42 has a non-flat face. <P>COPYRIGHT: (C)2010,JPO&INPIT |
