发明名称 SUBSTRATE DETECTION APPARATUS AND METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To easily and precisely specify the generation part and the generation state of a curvature in the complicated form that is found in the substrate, espectially in a large substrate without causing damages to the substrate by applying a voltage to the substrate, and to serve for sure chucking even in the large substrate. SOLUTION: A sensor part 2 has a first sensor group 11 provided at the center part of a mounting surface 1a, a second sensor group 12 surrounding the first sensor group 11, and a third sensor group 13 surrounding the second sensor group 12. The first sensor group 11 has an electrostatic capacity sensor 10a corresponding to the center part of the substrate surface. The second sensor group 12 has a plurality of electrostatic capacity sensors 10a coaxially surrounding the first sensor group 11. The third sensor group 13 has a plurality of electrostatic capacity sensors 10a coaxially surrounding the second sensor group 12 and provided close to the peripheral edge of the mounting surface 1a. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009224519(A) 申请公布日期 2009.10.01
申请号 JP20080066666 申请日期 2008.03.14
申请人 FUJITSU MICROELECTRONICS LTD 发明人 KURITA YUKI;MIMURA TADANORI
分类号 H01L21/683 主分类号 H01L21/683
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