发明名称 INSULATION SHEET AND LAMINATED STRUCTURAL BODY
摘要 PROBLEM TO BE SOLVED: To provide an insulation sheet bringing forth a cured object excellent in handleability, dielectric breakdown characteristics, thermal conductivity, and adhesion. SOLUTION: The insulation sheet 3 contains a polymer (A) as a copolymer of a (meta) acrylate compound having an epoxy group or the like as a side chain and a monomer having unsaturated carbon double bond in a skeleton used for bonding a high thermal conductor 4 with a thermal conductivity of 10 W/m×K or more to a conductive layer 2, with a weight-average molecular weight of 1,000,000 or more, an epoxy equivalent and/or an oxetane equivalent of 1,000 or less, and a Tg of 50°C or more, an epoxy monomer (B1) and/or an oxetane monomer (B2) having an aromatic skeleton with a weight-average molecular weight of 600 or less, a curing agent (C) that is phenol resin or acid anhydride having an aromatic skeleton or alicyclic skeleton, its hydrogenated matter or degenerated matter, and a filler (D) with a thermal conductivity of 30 W/m×K or more. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009224108(A) 申请公布日期 2009.10.01
申请号 JP20080065806 申请日期 2008.03.14
申请人 SEKISUI CHEM CO LTD 发明人 MAENAKA HIROSHI;AOYAMA TAKUJI;KUSAKA YASUNARI;HIGUCHI ISAO;WATANABE TAKASHI
分类号 H01B3/00;B32B15/092;C08K3/00;C08L61/00;C08L63/00;H01B17/62 主分类号 H01B3/00
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