| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming an electroless plating termination on a multilayer electronic component. SOLUTION: A step is for providing the multilayer electronic component including a plurality of internal electrode elements and a plurality of ceramic layers interleaved with the plurality of internal electrode elements, and following steps are included; a step of aligning tab parts of the plurality of internal electrode elements at an interval of a predetermined distance approximately not more than 10μm in column on a first side surface of the multilayer electronic component and a second side surface opposite to the first side surface, a step of preparing an electroless bath solution, and a step of depositing termination material on the first and second side surfaces of the multilayer electronic component, and immersing the multilayer electronic component in the electroless bath solution for a predetermined time to achieve self-determining formation of the electroless plating termination between the tab parts of the plurality of internal electrode elements arranged in column. The predetermined time is approximately shorter than 15 minutes. COPYRIGHT: (C)2010,JPO&INPIT
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