发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE UNDER WIRE-IN-FILM ADHESIVE |
摘要 |
An integrated circuit package in package system including: providing a substrate; mounting a wire bonded die with an active side over the substrate; connecting the active side to the substrate with bond wires; mounting a structure over the wire bonded die having a wire-in-film adhesive between the structure and the wire bonded die and overhangs at ends of the structure between the wire-in-film adhesive and the substrate; mounting support structures at the overhangs between the wire-in-film adhesive and the substrate; and encapsulating the wire bonded die and the structure with an encapsulation.
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申请公布号 |
US2009243070(A1) |
申请公布日期 |
2009.10.01 |
申请号 |
US20080055634 |
申请日期 |
2008.03.26 |
申请人 |
KO WONJUN;YOON BOHAN;PARK JOUNGUN |
发明人 |
KO WONJUN;YOON BOHAN;PARK JOUNGUN |
分类号 |
H01L23/12;H01L21/58 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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