发明名称 THERMALLY ENHANCED ELECTRICALLY INSULATIVE ADHESIVE PASTE
摘要 <p>A thermal interface material comprises larger conformable thermally conductive particles, and smaller ceramic thermally conductive particles in a binder. The binder can include thermoplastic (and optionally thermoset) particles and a fugitive liquid which are substantially insoluble in each other. The binder can also include a liquid epoxy. Each of the larger thermally conductive particles is itself a cohesive yet conformable agglomeration of platy particles.</p>
申请公布号 WO2009120376(A2) 申请公布日期 2009.10.01
申请号 WO2009US01935 申请日期 2009.03.26
申请人 DIEMAT, INC.;CZUBAROW, PAWEL;DIETZ, RAYMOND, L.;PATELKA, MACIEJ 发明人 CZUBAROW, PAWEL;DIETZ, RAYMOND, L.;PATELKA, MACIEJ
分类号 C09J9/00;C09J11/04 主分类号 C09J9/00
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