<p>A thermal interface material comprises larger conformable thermally conductive particles, and smaller ceramic thermally conductive particles in a binder. The binder can include thermoplastic (and optionally thermoset) particles and a fugitive liquid which are substantially insoluble in each other. The binder can also include a liquid epoxy. Each of the larger thermally conductive particles is itself a cohesive yet conformable agglomeration of platy particles.</p>
申请公布号
WO2009120376(A2)
申请公布日期
2009.10.01
申请号
WO2009US01935
申请日期
2009.03.26
申请人
DIEMAT, INC.;CZUBAROW, PAWEL;DIETZ, RAYMOND, L.;PATELKA, MACIEJ
发明人
CZUBAROW, PAWEL;DIETZ, RAYMOND, L.;PATELKA, MACIEJ