发明名称 |
Semiconductor wafer, semiconductor device, and method of manufacturing semiconductor device |
摘要 |
Provided is a semiconductor wafer with a scribe line region and a plurality of element forming regions partitioned by the scribe line region, the semiconductor wafer including: conductive patterns formed in the scribe line region; and an island-shaped passivation film formed above at least a conductive pattern, which is or may be exposed to a side surface of a semiconductor chip obtained by dicing the semiconductor wafer along the scribe line region, among the conductive patterns, so that the island-shaped passivation film is opposed to the conductive pattern. |
申请公布号 |
US2009243044(A1) |
申请公布日期 |
2009.10.01 |
申请号 |
US20090382540 |
申请日期 |
2009.03.18 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
TANAKA KOUJI;ISOZAKI SEIYA |
分类号 |
H01L29/06;H01L21/78 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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