摘要 |
<p>Provided is an electrochemical device applicable to high-temperature reflow soldering wherein a lead-free solder is used. An electric double layer capacitor (10-1) is provided with a package (14), which is composed of films and has sealing sections (14a1-14a3) which are formed by sealing, by heat sealing or the like, portions where the films overlap with each other. Each of the sealing sections (14a1-14a3) of the package (14) is entirely covered, in a closely bonded state, with a supporting body (16) having a rigidity higher than that of the film constituting the package (14).</p> |
申请人 |
TAIYO YUDEN CO., LTD.;HAGIWARA, NAOTO;ISHIDA, KATSUEI;YAWATA, KAZUSHI;KOBAYASHI, MOTOKI |
发明人 |
HAGIWARA, NAOTO;ISHIDA, KATSUEI;YAWATA, KAZUSHI;KOBAYASHI, MOTOKI |