发明名称 ELECTROCHEMICAL DEVICE
摘要 <p>Provided is an electrochemical device applicable to high-temperature reflow soldering wherein a lead-free solder is used. An electric double layer capacitor (10-1) is provided with a package (14), which is composed of films and has sealing sections (14a1-14a3) which are formed by sealing, by heat sealing or the like, portions where the films overlap with each other. Each of the sealing sections (14a1-14a3) of the package (14) is entirely covered, in a closely bonded state, with a supporting body (16) having a rigidity higher than that of the film constituting the package (14).</p>
申请公布号 WO2009119465(A1) 申请公布日期 2009.10.01
申请号 WO2009JP55566 申请日期 2009.03.16
申请人 TAIYO YUDEN CO., LTD.;HAGIWARA, NAOTO;ISHIDA, KATSUEI;YAWATA, KAZUSHI;KOBAYASHI, MOTOKI 发明人 HAGIWARA, NAOTO;ISHIDA, KATSUEI;YAWATA, KAZUSHI;KOBAYASHI, MOTOKI
分类号 H01G9/155;H01M2/02 主分类号 H01G9/155
代理机构 代理人
主权项
地址