| 摘要 |
Provided is a wireless IC device configured not to have shock or the like directly applied to a wireless IC chip from external. A wireless IC device (10) is provided with (a) a radiation plate (11), a wireless IC chip (24), and (c) a power feeding circuit board (22, 22a). The power feeding circuit board has a resonance circuit, which has the wireless IC chip (24) mounted thereon, includes an inductance element and is electromagnetically coupled with the radiation plate (11). The wireless IC chip (24) is arranged to be sandwiched between the radiation plate (11) and the power feeding circuit board (22, 22a).
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