发明名称 METHOD AND APPARATUS FOR MEASURING THICKNESS OF PLATING
摘要 <P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for measuring the thickness of plating, which make it possible to measure the thickness of an alloy layer contained in a hot-dip galvanized film. <P>SOLUTION: The present invention relates to a method and an apparatus for measuring the thickness of plating, which use a hot-dip galvanized steel plate as an anode, a counter electrode, and a reference electrode, perform galvanostatic electrolysis in a saturated aqueous solution of chloride of 1 mol/dm<SP>3</SP>or higher within an electrolytic current density range of 0.10 to 0.22 A/cm<SP>2</SP>, and measure, in accordance with the amount of electricity that is required for dissolution of a plating film, the respective thicknesses of zinc and alloy layers contained in a hot-dip galvanized film. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009222694(A) 申请公布日期 2009.10.01
申请号 JP20080105132 申请日期 2008.03.17
申请人 DENRO CORP;IWATE UNIV 发明人 YASHIRO HITOSHI;KONNO TAKASHI
分类号 G01N27/416;C23C2/06 主分类号 G01N27/416
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