发明名称 REFLOW SOLDER OVEN WITH COOLING DIFFUSER
摘要 A diffuser plate for a reflow oven includes an upper surface and a plurality of nozzle openings therein. Each of the plurality of nozzle openings has a raised surrounding portion for restricting condensed flux on the upper surface of the diffuser plate from flowing through the nozzles. A drain hole permits condensed flux on the upper surface to flow downward through the plate.
申请公布号 US2009242616(A1) 申请公布日期 2009.10.01
申请号 US20080057876 申请日期 2008.03.28
申请人 ILLINOIS TOOL WORKS INC. 发明人 DAUTENHAHN JONATHAN M.
分类号 B23K1/20;B23K37/00 主分类号 B23K1/20
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