CIRCUIT SUBSTRATE AND THE FABRICATION METHOD THEREOF

摘要

PURPOSE: A circuit substrate and a manufacturing method thereof are provided to prevent overflow of an insulation material by forming a groove part in a substrate between adjacent leads. CONSTITUTION: A photosensitive material is coated on a substrate(201) in which a plurality of leads(202) is prepared. A groove part(210) is formed on the substrate between the leads by exposing, developing, and etching the photosensitive material. The photosensitive material is removed. An insulation material(211) is coated on the leads. The insulation material is an optical solder resist. The substrate is a polymer film.