发明名称 METHOD AND MECHANISM FOR FORMING THROUGH-HOLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method and a mechanism for forming a through-hole, which improves working efficiency, easily positions the formed through-hole and a supplied conductive material. Ž<P>SOLUTION: A hole-making drill 2 having a discharging hole 2a formed on a tapered portion on the chip pierces a paper base material 15 till when part of the discharging hole 2a can appear on the opposite side of the paper base material 15, and then a conductive paste 4a is discharged through the discharging hole 2a when pulling out the hole-making drill 2 from the paper base material 15. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009224675(A) 申请公布日期 2009.10.01
申请号 JP20080069483 申请日期 2008.03.18
申请人 TOPPAN FORMS CO LTD 发明人 NAWA SHIGEAKI;KONDO MASATOSHI;IGUCHI NAOKI;MORI AKIHITO;HONMA YOSHINORI;FUJITA BUNICHI;YOSHIKAWA RIE
分类号 H05K3/40 主分类号 H05K3/40
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