| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve conductivity between a wiring pattern and a through-hole which are formed on front and rear surfaces of a base material. Ž<P>SOLUTION: The method for forming a through-hole is used to form a conduction portion 13 electrically connecting connection patterns 16a, 16b formed on front and rear surfaces via a conductive paste 4a, on a paper base material 15 having the connection patterns 16a, 16b formed on the front and rear surfaces. The method includes a step of forming the through-hole 17 on a region of the paper base material 15 where the connection patterns 16a, 16b are formed, a step of closely contacting a nozzle 5 having an inner diameter larger than the through-hole 17 so as to cover the through-hole 17 from the lower part of the paper base material 15, and a step of discharging the conductive paste 4a from the nozzle 5. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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