MAGNETIC SENSOR PACKAGE

摘要

Provided is a magnetic sensor package with a reduced size. An IC (2) as a semiconductor element is mounted on the main surface of a base (1). An X-axis magnetic sensor (3a), a Y-axis magnetic sensor (3b), and a Z-axis magnetic sensor (3c) are mounted on the main surface of the IC (2). When mounting the Z-axis magnetic sensor (3c), an auxiliary bump (4) is arranged on an electrode pad (2a) and a corner bump (5) electrically connected to an electrode pad (3d) is arranged on the auxiliary bump (4) so as to electrically connect the Z-axis magnetic sensor (3c) to the IC (2) via the auxiliary bump (4) and the corner bump (5).