| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which includes pads electrically connected to chip connecting pads through conductive wires, the wiring board being reduced in size in a surface direction of the wiring board by efficiently arranging the pads electrically connected to the chip connecting pads. <P>SOLUTION: The wiring board includes a resin member 12 formed in a plate shape, chip connecting pads 13 each having a connection surface electrically connected to the electrode pads provided to a semiconductor chip and incorporated in the resin member 12, pads 14 incorporated in the resin member 12 at a part positioned outside a formation region of the chip connecting pads 13, routing wiring 17 connected to the pads 14, and the conductive wire sealed with the resin member 12 and electrically connecting the chip connecting pads 13 and the pads 14 to each other, the pads 14 being disposed on a plurality of straight lines B<SB>1</SB>parallel to a first direction. <P>COPYRIGHT: (C)2010,JPO&INPIT |
