发明名称 CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To solve such a problem that since a force by a screw stop does not directly contribute to make a heat dissipation substrate very strong with a conventional heat dissipation substrate, when a very strong tensility, a very strong vibration or the like are added, the conventional heat dissipation substrate may be partially peeled or disconnected. SOLUTION: A circuit module 116 includes: a metal plate 101 and a heat transmission layer 102; a heat dissipation substrate 120 having lead frames 103 and connecting terminals 104; a resin structure 113 provided on this heat dissipation substrate 120; and fixing clamps such as screws 114 or the like for fixing this resin structure 113. The heat dissipation substrate 120 and the circuit module 116 can be made very strong, since it is so constituted that binding forces by the screws 114 or the like may negate external forces given from exteriors to the lead frames 103 and the connecting terminals 104. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009224445(A) 申请公布日期 2009.10.01
申请号 JP20080065389 申请日期 2008.03.14
申请人 PANASONIC CORP 发明人 KONO HITOSHI;ONISHI TORU;TANIGUCHI TOSHIYUKI
分类号 H01L23/40;H01L23/36 主分类号 H01L23/40
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