| 发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION |
| 摘要 |
An integrated circuit package system comprising: forming a base package having a molded top; providing a surface contact on the base package; and patterning a redistribution layer on the molded top for coupling the surface contact.
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| 申请公布号 |
US2009243069(A1) |
申请公布日期 |
2009.10.01 |
| 申请号 |
US20080055612 |
申请日期 |
2008.03.26 |
| 申请人 |
CAMACHO ZIGMUND RAMIREZ;TAY LIONEL CHIEN HUI;BATHAN HENRY DESCALZO;ADVINCULA ABELARDO JR |
发明人 |
CAMACHO ZIGMUND RAMIREZ;TAY LIONEL CHIEN HUI;BATHAN HENRY DESCALZO;ADVINCULA ABELARDO JR. |
| 分类号 |
H01L23/12;H01L21/58 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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