| 摘要 |
The present invention provides a frit containing substantially no lead, which is applicable to a member having alpha of at most 50x10<7/° C. A frit comprising a low-melting point glass powder and a refractory filler powder, containing substantially no lead, having a thermal expansion coefficient of at most 50x10-7/° C., and being processable at 500° C. or lower, wherein the above low-melting point glass powder satisfies a softening pour point range of at least 30° C., and the above refractory filler powder satisfies the following relationship: <?in-line-formulae description="In-line Formulae" end="lead"?>1<Sxrho<10 <?in-line-formulae description="In-line Formulae" end="tail"?> S: specific surface area (m2/g) rho: density (g/cm3)
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