| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for temporarily protecting the surface of a metal plate, a glass plate, a plastic plate and the like and an adhesive sheet for processing electronic components, and more precisely, a peelable adhesive agent used for the adhesive sheet for fixing a semiconductor in a dicing step or a back-grinding step of a semiconductor wafer, a semiconductor substrate and the like. SOLUTION: The peelable adhesive agent is obtained by crosslinking an active energy-curable resin composition [I] comprising a polyester resin (A) and an unsaturated group-containing compound (B) with a crosslinking agent (C). COPYRIGHT: (C)2010,JPO&INPIT
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