发明名称 |
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD HAVING DIFFERENT THICKNESSES IN DIFFERENT AREAS |
摘要 |
A method for manufacturing a printed circuit board (PCB) having different thicknesses in different areas includes: providing a first substrate having two lateral unwanted portions bounded two imaginary boundary lines, a binder layer having a through opening and a second substrate having a mounting area for mounting electronic elements; forming two slots bounded the imaginary boundary lines in an intermediated unwanted portion of the first substrate corresponding to the mounting area; laminating the first and second substrates, and the binder layer with the mounting area exposed via the through opening; filling the two slots and the through opening with a filling material, thereby obtaining a semifinished PCB board; cutting the semifinished PCB board along the imaginary boundary lines to remove the two lateral unwanted portions and a portion of the second substrate corresponding to the two lateral unwanted portions; and removing the intermediate unwanted portion and the filling material.
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申请公布号 |
US2009241333(A1) |
申请公布日期 |
2009.10.01 |
申请号 |
US20080274190 |
申请日期 |
2008.11.19 |
申请人 |
FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.;FOXCONN ADVANCED TECHNOLOGY INC. |
发明人 |
HE DONG-QING;WANG MING;ZHU YUN-LI;LEE WEN-CHIN |
分类号 |
H05K3/36 |
主分类号 |
H05K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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