发明名称 Heat-dissipating module
摘要 A heat-dissipating module includes a heat sink, a plurality of fixtures, and a plurality of fasteners. The heat sink includes a plurality of fins and a plurality of hollowed portions located at a periphery thereof. Each of the fixtures includes a support portion and two lap joint portions. Each of the two lap joint portions has a fasten hole. Each of the support portions has a support hole. Each of the fixtures corresponds to one of the hollowed portions. The two lap joint portions of each fixture are mounted to a top edge of the fins and close to two sides of the support portion. The fasteners fasten the lap joint portions to the heat sink. In this way, the heat sink and the fixtures are fastened with each other to enhance the structural durability of the heat-dissipating module. In addition, the heat-dissipating module is small-sized, taking less space.
申请公布号 US2009244844(A1) 申请公布日期 2009.10.01
申请号 US20080213247 申请日期 2008.06.17
申请人 TAI-SOL ELECTRONICS CO., LTD. 发明人 LIAO CHIN-CHUN;KO MENG-HUNG
分类号 H05K7/20 主分类号 H05K7/20
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